玻璃芯基板

High density vertical optical interconnects for...

Citation D. Weninger, S. Serna, A. Jain, L. Kimerling, and A. Agarwal, “High density vertical optical interconnects for passive assembly,” Opt. Express, vol. 31, no. 2, pp. 2816–2831, Jan. 2023. ...

Live single cell imaging assays in glass microw...

Citation Sandström, N., Brandt, L., Sandoz, P. A., Zambarda, C., Guldevall, K., Schulz-Ruhtenberg, M., Rösener, B., Krüger, R. A., & Önfelt, B. (2022). Live single cell imaging assays in glass...

Miniaturised wideband bandpass filter with good...

Citation Zhou, Y., et al.: Miniaturised wideband bandpass filter with good selectivity based on 3D heterogeneous integrated passive device technology. IET Microw. Antennas Propag. 18(4), 266–271 (2024). https://doi.org/10.1049/mia2.12447 Keywords 5G...

Low Loss Chip-to-Chip Couplers for High Density...

Citation Weninger, D., Serna, S., Ranno, L., Kimerling, L., & Agarwal, A. (2024). Low Loss Chip-to-Chip Couplers for High Density Co-Packaged Optics. Journal of Hypothetical Examples, Volume Number(Issue Number), Page...

Design of Power/Ground Noise Suppression Struct...

Citation Kim, Y. Design of Power/Ground Noise Suppression Structures Based on a Dispersion Analysis for Packages and Interposers with Low-Loss Substrates. Micromachines 2022, 13, 1433. Keywords electromagnetic bandgap (EBG) interposers...

集成硅光子封装

引用 Hwang, H. Y. (2019). 集成硅光子封装 [博士论文，科克大学]。https://hdl.handle.net/10468/9524 关键词 硅光子学 封装 集成 光学组件 电中介层 光栅耦合器 衰减耦合 MEMS光开关 简介 本论文旨在通过开发和演示先进的封装技术，弥合硅光子学研究与制造之间的差距，重点关注高密度集成和无源光学组件。 摘要 How Yuan Hwang (2019) 的博士论文《集成硅光子封装》探索了先进的硅光子封装技术，旨在弥合器件制造与最终封装产品之间的差距。论文强调了高密度集成和高效光耦合方法的需求，以实现硅光子封装的大规模生产。Hwang 使用加州大学伯克利分校最先进的硅光子 MEMS 光开关作为测试器件，演示了已开发的封装解决方案。 该论文探讨了硅光子器件中高密度电气和光学互连所带来的挑战。论文介绍了两代封装解决方案： 第一代封装涉及一个 12x12...