Fabrication of Panel-Level Glass Substrates with Complete Design Freedom using LIDE
Citation
Authors: Rafael Santos, Nils Anspach, Norbert Ambrosius, Stephan Schmidt, Roman Ostholt
Publisher: LPKF Laser & Electronics AG
Keywords
- Laser Induced Deep Etching (LIDE)
- Through-Glass Vias (TGVs)
- Interposer
- Glass
- Silicon
- Semiconductor Packaging
- Cost-effective
- High-throughput
- Design freedom
- Defect-free
Brief
Laser Induced Deep Etching (LIDE) is a cost-effective, high-throughput technology that enables the fabrication of glass interposers with Through-Glass Vias (TGVs) of any dimension and geometry, making glass a viable alternative to silicon in semiconductor packaging.
Summary
The article focuses on the advantages of glass as a material for interposers in the semiconductor packaging industry and presents Laser Induced Deep Etching (LIDE) as a cost-effective and precise technology for processing glass into interposers.
While glass possesses several ideal material properties for interposer applications, such as high electrical resistivity, low loss tangent and dielectric constant, low warpage, and compatibility with silicon in terms of CTE, its use has been limited due to the lack of efficient processing technologies. LIDE addresses this issue by offering a two-step process that allows for the high-volume fabrication of defect-free glass components.
The first step of the LIDE process involves a fast, maskless laser that directly modifies the glass substrate with a single pulse. The second step entails a wet-etching process that removes the laser-modified regions, creating Through-Glass Vias (TGV). This process allows LIDE to fabricate thousands of TGV per second with high accuracy and in various dimensions and aspect ratios. The article emphasizes the cost-effectiveness of LIDE, highlighting its potential to make glass a widely adopted material for interposer applications in the semiconductor industry.
Origin: https://www.semanticscholar.org/paper/Fabrication-of-Panel-Level-Glass-Substrates-with-Santos-Anspach/89a41ccc9585aa4bea840ccd771f0a101f29c057