Research on the laminating technology of embedded optical fiber array PCB
Citation
林洪德, 吴军权. (2023). 光纤阵列埋入式PCB的压合技术研究 [Research on the laminating technology of embedded optical fiber array PCB]. 2023春季国际PCB技术/信息论坛 (2023 Spring International PCB Technology/Information Forum), 增刊, 170-173. Paper Code: S-074. In 特种印制板制造技术 Special PCB technology (Special PCB technology). Article Number: 1009-0096（2023）增刊-0170-04
Keywords
- 光纤阵列 / Optical Fiber Array
- 压合技术 / Laminating Technology
- 埋入式PCB / Embedded PCB
- 多通道光信号传输 / Multi-channel optical signal transmission
- 层压结构设计 / Laminated structure design
- 开槽设计 / Slotting design
- 压合参数 / Laminating parameters
- MT-MT封装 / MT-MT packaging
- 热可靠性 / Thermal reliability
- 光电互连 / Optoelectronic interconnection
- FA-MT跳线 / FA-MT jumper
Brief
The article discusses the lamination techniques for embedding optical fiber arrays within PCBs to enable high-integration, multi-channel optical signal transmission by focusing on specific structural designs, slotting methods, and lamination parameters that ensure the integrity and thermal reliability of the embedded components.
Summary
This paper explores the techniques for embedding optical fiber arrays into PCBs to achieve high-speed, multi-channel optical communication by detailing special lamination structures, slot designs, and pressing parameters needed to ensure the integrity and reliability of the embedded optical fibers, which utilize MT-MT jumpers internally and can connect to FA-MT jumpers externally. The process adapts existing multi-layer PCB manufacturing with a focus on lamination to protect the optical fibers during high-temperature and pressure processing..
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