Study Photo Imagable dielectric (PID) and non-PID on process, fabrication and reliability by using panel glass substrate for next generation interconnection
Citation
*Chun-Hsien Chien, Chien-Chou Chen, Wen-Liang Yeh, Wei-Ti Lin, Cheng-Hui Wu, Fu-Yang Chen, Yi-Cheng Lin, Po-Chiang Wang, Jeng-Ting Li, Bo Cheng Lin, Yu-Hua Chen, Tzyy-Jang Tseng. "Study Photo Imagable dielectric (PID) and non-PID on process, fabrication and reliability by using panel glass substrate for next generation interconnection." International Symposium on Microelectronics, vol. 2019, no. 1, Jan. 2019.
Keywords
- Photo Imageable Dielectric (PID)
- Glass Substrate
- Reliability
- High Density Interconnection
- IC Carrier
- Redistribution Layers (RDL)
- Fine Line/Via Formation
- Semi Additive Process (SAP)
- Thermal Cycling Test (TCT)
- Highly Accelerated Stress Test (HAST)
Brief
The article examines the use of glass, as opposed to traditional organic materials, in the fabrication of integrated circuit carriers and printed circuit boards, finding that glass substrates offer significant benefits for creating fine line and via interconnections.
Summary
This article investigates the use of glass as a material for next-generation interconnection in the semiconductor industry.
- Traditional organic substrates face challenges such as warpage, surface roughness, and material dimension stability issues, especially for high-density interconnections with very fine lines.
- Glass, on the other hand, offers benefits such as a low profile surface suitable for high-density applications, good size effect for large form factors, and good dimension stability.
- The article explores the use of both photo-imagable dielectric (PID) and non-PID materials with glass substrates for fine line and via interconnections.
- The authors chose a dry film PID and a non-PID material and evaluated them for characteristics like chemical resistance, adhesion strength, and compatibility with various processes like laser drilling and plasma treatment.
- They fabricated test vehicles with both materials to evaluate their reliability under thermal cycling and highly accelerated stress tests.
- The results show that both PID and non-PID materials, when used with glass substrates, have the potential to be used for fine line and via interconnections in next-generation semiconductor packaging.