ガラスコア基板

Glass core substrates offer some key advantages over traditional silicon base substrates, particularly for high-performance applications:

Thermal stability: Glass can handle higher temperatures without warping or degrading, which is crucial for managing heat in powerful chips. This allows for tighter packing of transistors and better overall performance.

Signal integrity: Glass has a lower coefficient of thermal expansion (CTE) that more closely matches silicon itself. This reduces stress on electrical connections during temperature changes, leading to faster and more reliable signal transmission.

Smaller vias: The ability of glass to handle tighter tolerances allows for the creation of smaller vias (holes for electrical connections) which can improve packing density and signal speed.

Optical transparency: While not always relevant, some applications can benefit from the transparency of glass, allowing for integration of optical components or light-based sensors.