3D SiP Assembly and Reliability for Glass Substrate with Through Vias
Citation
Authors: Ra-Min Tain, Dyi-Chung Hu, Kai-Ming Yang, Yu-Hua Chen, Jui-Tang Chen, De-Shiang Liu, and Chen-Hao Lin
Title: 3D SiP Assembly and Reliability for Glass Substrate with Through Vias
Publisher: Unimicron Technology Corp.
Year: 2016 (Assumed based on the file name "isom-2016-wp22.pdf")
Keywords
- Glass substrate
- Through-glass vias (TGVs)
- System-in-package (SiP)
- Direct-metal-on-glass (DMoG)
- Reliability
- Assembly
- Design
Brief
This article describes the design and reliability testing of a system-in-package (SiP) module that uses a glass substrate with through-glass vias (TGVs) as conductors.
Summary
This article, likely published in 2016, presents a study by researchers from Unimicron Technology Corp. on the assembly and reliability of a System-in-Package (SiP) module using a glass substrate with through-glass vias (TGVs).
Here are the key points of the article:
- The researchers developed a SiP module that utilizes a glass substrate with TGVs for high-performance applications. The TGVs, with a diameter of 100μm and a thickness of 200μm, are formed using a direct-metal-on-glass (DMoG) technique.
- The article describes the design rules, materials, and fabrication process of the TGV substrate. This includes details about the DMoG RDL, build-up RDLs, and interconnect vias.
- The assembly process of the SiP module, involving the mounting of a mechanical test die on the TGV substrate, is outlined. Daisy-chain RDLs are incorporated into both the substrate and the test die for electrical testing.
- The article presents the results of thermal cycling tests (TCT) conducted on the SiP modules. The results show that the majority of daisy chains (96%) exhibit less than a 10% change in resistance after 200 TCTs, indicating promising reliability.
- Failure analysis, primarily using 3D X-ray microscopy, suggests that the uneven surface of the nickel-plated bonding pads might be a contributing factor to daisy chain failures.
The article concludes by stating that further investigation into the failure mechanism will be conducted using SEM inspections and additional TCT reliability testing will be carried out.