A metal oxide adhesion layer prepared with water based coating solution for wet Cu metallization of glass interposer
Citation
Liu, Z., Hunegnaw, S., Fu, H., Wang, J., Magaya, T., Merschky, M., Bernhard, T., Shorey, A., & Yun, H. (2015). A metal oxide adhesion layer prepared with water based coating solution for wet Cu metallization of glass interposer. International Symposium on Microelectronics.
Keywords
- Glass Interposer
- Metal Oxide Adhesion Layer
- Wet Cu Metallization
- Through Glass Via (TGV)
- Coating Uniformity
- Adhesion
- Dip-Coating
- Morphology
- Safety
Brief
This article discusses a water-based solution, VitroCoat GI W, that enables reliable copper plating for Through Glass Vias (TGVs) on glass interposers, a critical technology for advanced microelectronics packaging.
Summary
The article, published in 2015, discusses a new method for metallization of glass interposers using a water-based metal oxide adhesion layer.
- The authors argue that inorganic interposers, especially those made of glass, are becoming increasingly important in advanced high-frequency applications and ultra-fine line patterning technology.
- One of the challenges with using glass interposers is the difficulty in achieving reliable metallization, which is crucial for creating electrical circuits.
- The sources describe a novel water-based solution called VitroCoat GI W that can be applied to glass substrates to create an ultra-thin (about 10nm) metal oxide adhesion layer. This layer enables the direct plating of copper onto the glass, a process that would otherwise be difficult due to the smooth surface of glass.
- The article presents research on the effectiveness of VitroCoat GI W, highlighting its uniformity on flat glass surfaces and its ability to coat through glass vias (TGVs) with high aspect ratios while minimizing blockage. The authors present findings on the adhesion strength of the copper plating, showing it to be sufficient for downstream packaging processes. They also investigate the morphology of the VitroCoat layer and its interface with the glass substrate, providing evidence of strong chemical bonding that contributes to the robust adhesion.
Overall, the article presents a promising solution for the metallization of glass interposers, a critical step in advancing electronic packaging technology for high-frequency applications.