Addressing Next Generation Packaging and IoT with Glass Solutions
Citation
Shorey, Aric, Rachel Lu, Kevin Adriance, and Gene Smith. “Addressing Next Generation Packaging and IoT with Glass Solutions.” International Symposium on Microelectronics, 2016.
The article was published in the proceedings of the International Symposium on Microelectronics in 2016. The authors are listed as Aric Shorey, Rachel Lu, Kevin Adriance, and Gene Smith, all affiliated with Corning Incorporated. The source includes a link to the article: http://meridian.allenpress.com/ism/article-pdf/2016/1/000277/2255042/isom-2016-wp21.pdf, which was accessed on July 23, 2024.
Keywords
Brief
This article discusses the advantages of using glass in advanced packaging to achieve the goals of next-generation products for mobile communications and sensors.
Summary
Here is a TLDR of the article, "Addressing Next Generation Packaging and IoT with Glass Solutions":
- The article explores the potential of glass for advanced packaging in electronics, particularly for applications like the Internet of Things (IoT) which requires cost-effective and high-performance solutions.
- Glass is presented as a suitable material due to its low electrical loss, high stiffness, and adjustable coefficient of thermal expansion. These properties make it advantageous for high-frequency RF applications and managing warp in substrates.
- The authors highlight the cost-effectiveness of glass, emphasizing its suitability for panel fabrication in large form factors, aligning with the scale demands of IoT devices.
- Advancements in glass handling and metallization processes, especially in Through Glass Via (TGV) technology, are discussed, showcasing its viability for next-generation electronics.
- The article provides examples of glass use in RF passives and antennas, taking advantage of its insulating properties for high-Q performance.
- The authors illustrate the successful implementation of glass as an interposer material, capitalizing on its low insertion loss, adjustable CTE, and compatibility with existing manufacturing processes.
- The article concludes by emphasizing the increasing adoption of glass in various electronics applications due to its material properties, cost-effectiveness, and suitability for next-generation technologies like 5G mobile networks.
The article primarily focuses on the technical capabilities and applications of glass in electronics packaging. It does not discuss potential drawbacks or limitations of using glass.