Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter
Citation
Chen, Z.; Yu, D.; Zhong, Y. Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter. Sensors 2022, 22, 2114. https://doi.org/10.3390/s22062114
Keywords
- RF filter
- Wafer-level packaging (WLP)
- Through glass vias (TGVs)
- Transient liquid phase (TLP) bonding
- Hermetic packaging
- Reliability
- Low cost
- High-quality factor (Q)
- Low insertion loss
Brief
This article presents a novel, cost-effective approach to packaging radio frequency filters, utilizing through glass vias and transient liquid phase bonding for high performance and reliability.
Summary
This article, published in 2022 in the journal Sensors, describes the development of a new method for packaging radio frequency (RF) filters.
Here are the key takeaways:
- Demand for RF filters, which are essential components in mobile devices and other wireless communication systems, is increasing due to the rollout of 5G technology.
- RF filters need to be hermetically sealed to protect them from environmental damage and ensure optimal performance.
- The authors developed a three-dimensional wafer-level package (3D WLP) that uses through-glass vias (TGVs) to create a hermetic seal.
- TGVs are a cost-effective alternative to traditional through-silicon vias (TSVs) because they can be fabricated without masking or lithography.
- The packaging process involves bonding a glass interposer with Cu-filled TGVs to an RF filter substrate using an Au-Sn transient liquid phase (TLP) bonding technique.
- The resulting package is only 300 µm thick and exhibits excellent shear strength (54.5 MPa), surpassing standard requirements.
- Electrical performance testing demonstrated that the packaging process did not degrade the performance of the RF filter.
- This new packaging method offers a promising solution for the high-volume production of low-cost, high-performance RF filters for 5G applications.