Glass Solutions for Packaging and IoT
Citation
Lu, Rachel, and Aric Shorey. “Glass Solutions for Packaging and IoT.” Proceedings of the 48th International Symposium on Microelectronics, 2017, pp. 473–78.
Keywords
- Glass
- Through Glass Via (TGV)
- Panel
- Reliability
- RF Applications
- Interposer
- Semiconductor Packaging
- Metallization
- Thermal Cycle Tests (TCT)
- Drop Tests
- MEMS Device
Brief
This article discusses the advantages of using glass in advanced semiconductor packaging applications, particularly for its electrical and thermal properties and its suitability for applications like RF filters and 3D-IC interposers.
Summary
This article from the 2017 Proceedings of the 48th International Symposium on Microelectronics by Rachel Lu and Aric Shorey, titled "Glass Solutions for Packaging and IoT", highlights the growing potential of glass as a material in semiconductor packaging, particularly for RF applications and interposers.
Here are the key takeaways:
- Glass offers a unique set of properties advantageous for advanced packaging: These properties include low electrical loss at high frequencies, high stiffness, adjustable coefficient of thermal expansion (CTE), and the ability to be manufactured in thin and large formats.
- Glass is cost-effective: Manufacturing processes, like Corning's fusion forming process, allow for the creation of large glass panels as thin as 100 µm, which can lower production costs.
- The technology surrounding glass in semiconductor packaging is mature and reliable: The sources cite advancements in through-glass via (TGV) formation, metallization, and dicing processes, leading to volume manufacturing capabilities.
- Researchers have demonstrated the reliability of glass solutions through various tests: This includes thermal cycling tests (TCT) and drop tests, with glass interposers exhibiting reliable electrical and mechanical performance.
- Glass is suitable for a broad range of applications: The article describes the successful use of glass in RF filter and switching applications, with potential in emerging technologies like MEMS devices for DC to RF switching.
In conclusion, the article positions glass as a versatile and reliable material for the future of semiconductor packaging, particularly as technology advances towards 5G networks and the Internet of Things.