Hermetically Sealed Glass Packages

Hermetically Sealed Glass Packages

Citation

The sources provide an excerpt of the article "Hermetically Sealed Glass Packages" by Roupen Keusseyan and Tim Mobley. The article was presented at the International Symposium on Microelectronics ([ISM]). While the sources do not contain the year of the symposium, they do indicate the article can be found in the symposium's proceedings. The source excerpts are from a PDF document named "41 isom-2015-wp23.pdf," which suggests the symposium occurred in 2015.

Keywords

  • TGV (Through Glass Via)
  • Borosilicate Glass
  • Hermeticity
  • Copper Metallization 
  • Thermal Expansion Matching
  • CMP (Chemical Mechanical Polishing)
  • RDL (Redistribution Layers)
  • Via Interconnection
  • High Reliability

Brief

This article describes a new core packaging technology that utilizes borosilicate glass interposers, copper metallization with thermal expansion matching, and Through Glass Via (TGV) technology to enable the creation of hermetically sealed glass packages. 

Summary

This article summarizes a new core packaging technology that uses borosilicate glass interposers. The technology uses Through Glass Via (TGV) technology to create hermetically sealed glass packages.

Here are some key features of this new technology:

  • It allows for higher performance and reliability in electronic designs.
  • It leverages low cost system solutions and scalability to large panel glass processing.
  • The copper metallization has high conductivity.
  • The technology boasts thermal expansion matching with the borosilicate glass.
  • It offers hermeticity in the range of 10E-10 Atm.cc/sec (Ultra-High Vacuum Hermeticity).

The article details the material and process challenges of creating this technology. This new technology will allow for circuit designs to be integrated into a wide range of applications, such as glass displays, life sciences, microfluidic and 2.5D packaging applications. The article was written by Roupen Keusseyan and Tim Mobley from Triton MicroTechnologies, Inc. It is missing information regarding the year and journal of publication.

Origin: https://meridian.allenpress.com/ism/article/2015/1/000375/187703/Hermetically-Sealed-Glass-Packages

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