Articles

What is through glass vias?

Through Glass Vias (TGV)Through Glass Vias (TGV) represents a pivotal technology in the realm of advanced electronic packaging, which involves the creation of vertical electrical connections (vias) passing directly through...

What is the difference between interposer and s...

Difference Between Interposer and SubstrateInterposers and substrates are crucial components in the realm of semiconductor packaging, each serving distinct functions and offering different advantages. Understanding the difference between the two...

What does an interposer do?

What is an Interposer?An interposer is a crucial element in the world of electronics, acting as an intermediary layer that connects a semiconductor device, such as an integrated circuit (IC),...

What is a glass interposer?

Glass Interposer: An OverviewA glass interposer is a critical component utilized in the field of microelectronics, serving as a bridging platform between the silicon chip and the substrate or printed...

What is a glass core?

Glass Core TechnologyThe glass core technology represents an innovative shift in the manufacturing of electronic interconnects and circuits, leveraging the unique properties of glass to enhance performance, miniaturization, and functionality...

What are the benefits of glass substrate?

Benefits of Glass SubstrateGlass substrates are critical components in a multitude of optical, electronic, and electro-optical devices and applications. Their popularity stems from a combination of properties that make glass...