Glass Package and Through Glass Via (TGV) for MEMS

Glass Package and Through Glass Via (TGV) for MEMS

Citation

Author: Aric B. Shorey, PhD
Title: "Glass Package and Through Glass Via (TGV) for MEMS"
Subtitle: "Enabling the electrification of everything Milliwatts-to-kilowatts, DC-to-light" 

Keywords

  • Menlo Microsystems
  • Ideal Switch
  • MEMS
  • Glass Substrates
  • Through Glass Vias (TGV)
  • Hermetic Packaging
  • Laser Processing
  • High Aspect Ratio
  • Applications 

Brief

Menlo Microsystems is driving a maturing and growing glass supply chain for the production of next-generation ohmic switches with their Ideal Switch, demonstrating a combination of metal MEMS processing with glass substrates. 

Summary

The presentation, "Glass Package and Through Glass Via (TGV) for MEMS: Enabling the electrification of everything Milliwatts-to-kilowatts, DC-to-light," by Aric Shorey, Director of Glass Technologies at Menlo Microsystems, highlights the growing importance and capabilities of glass substrate applications in the realm of microelectronics. It specifically emphasizes the use of Through Glass Vias (TGVs) for creating smaller, more efficient, and higher-performing electronic components.

The presentation argues that the supply chain for glass packaging is maturing, with more suppliers and capabilities emerging. Several companies, including SCHOTT, AGC Packaging, Samtec, 3D Glass Solutions, Mosaic Microsystems, Microplex, LPKF, Swift Glass, UNITY-SC Technologies, and Lumina Instruments, are cited as key players in this expanding market.

One of the key advancements highlighted is the use of glass and TGV technology in Menlo Microsystems' Ideal Switch™. This innovative micro-mechanical switch boasts superior performance characteristics, including a smaller size, hermetic packaging, ultra-low loss, wide operational bandwidth, and the ability to handle high voltage.

The presentation concludes by emphasizing that glass substrate applications are poised for significant expansion beyond their traditional use in microfluidics and optical devices, particularly in RF and Power applications. The sources suggest that Menlo Microsystems is at the forefront of this movement, driving innovation and pushing the boundaries of what is possible with glass in microelectronics. 

Origin: https://www.semanticscholar.org/paper/Glass-Package-and-Through-Glass-Via-(TGV)-for-MEMS-Shorey/f4ca8ffe10b20a685a6fb22ddc7c3d74be6ccd53
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