ガラスコア基板

Research on Wafer-Level MEMS Packaging with Thr...

Citation Yang, F.; Han, G.; Yang, J.; Zhang, M.; Ning, J.; Yang, F.; Si, C. Research on Wafer-Level MEMS Packaging with Through-Glass Vias. Micromachines 2019, 10, 15.  Keywords Wafer-level packaging...

Through-Glass Vias for Glass Interposers and ME...

Citation M. J. Laakso, S. J. Bleiker, J. Liljeholm, G. E. Mårtensson, M. Asiatici, A. C. Fischer, G. Stemme, T. Ebefors, and F. Niklaus, "Through-Glass Vias for Glass Interposers and...

Low-Loss, High-Linearity RF Interposers Enabled...

Citation Shah, U., Liljeholm, J., Campion, J., Ebefors, T., & Oberhammer, J. (2018). Low Loss High Linearity RF Interposers Enabled by Through-Glass Vias. IEEE Microwave and Wireless Components Letters, 28(11),...

Nonlinear multiphoton modification of glass sub...

Citation Lee, M.-K., Yu, J.-Z., Chang, H.-Y., Chang, C.-Y., Liu, C.-S., & Lin, P.-C. (2022). Nonlinear multiphoton modification of glass substrates for fabrication of high aspect ratio through-glass vias. AIP...

Development of 3D Wafer Level Hermetic Packagin...

Citation Chen, Z.; Yu, D.; Zhong, Y. Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter. Sensors 2022,...

Millimeter-Wave Substrate Integrated Waveguide ...

Citation Hyeon, I.-J.; Baek, C.-W. Millimeter-Wave Substrate Integrated Waveguide Using Micromachined Tungsten-Coated Through Glass Silicon Via Structures. Micromachines 2018, 9, 172.Please note that this citation format may need to be...