Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration

Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration

Citation

Huang, T.-J.; Kiebala, T.; Suflita, P.; Moore, C.; Housser, G.; McMahon, S.; Puchades, I. Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration. Electronics 2024, 13, 1818. https://doi.org/10.3390/electronics13101818 

Keywords

  • glass
  • heat capacity
  • molybdenum
  • printed circuit board
  • silicon
  • system-on-foil
  • thermal conductivity

Brief

This article describes how in situ resistors fabricated on molybdenum, silicon, and glass substrates were used to characterize their thermal properties for advanced electronics packaging applications. 

Summary

This article, published in 2024 in the journal Electronics, compares the thermal properties of molybdenum to silicon and fused silica glass for use as a system-on-foil (SoF) substrate. The authors found that molybdenum dissipates heat similarly to silicon and much more effectively than fused silica glass.

Here is a more detailed summary of the article:

  • The authors fabricated heating and sensing resistors on 250 µm thick wafers of molybdenum, silicon, and fused silica glass.
  • They applied various power levels to the heating resistors and measured the temperature change of the substrates.
  • The results show that molybdenum and silicon substrates only experience a 10–20 °C temperature increase when 1.2–3.1 W/mm2 of heat is applied continuously, while the surface temperature of the fused silica glass substrate increases by more than 140 °C under the same conditions.
  • These findings suggest that molybdenum, like silicon, is an effective material for dissipating heat in electronic devices.
  • The study also found that fused silica glass is better at laterally insulating heat than silicon or molybdenum. This means that heat is more likely to spread within silicon and molybdenum substrates than within a fused silica glass substrate.
  • The authors conclude that molybdenum is a viable material for use as a SoF substrate due to its favorable thermal properties. They suggest that combining materials with high and low thermal conductivity, such as molybdenum and silicon oxide, could be valuable for future 3D packaging architectures.

Origin: https://www.semanticscholar.org/reader/0a323b889b0334e3605c61f30b9ee0ae84809bc2

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