Glass Packaging for RF MEMS

Glass Packaging for RF MEMS

Citation

Parmar, R., & Zhang, J. (2018). Glass Packaging for RF MEMS. International Symposium on Microelectronics.

Keywords

  • Glass Packaging
  • RF MEMS
  • 5G Mobile Networks
  • Through Glass Vias (TGVs)
  • Low Loss
  • High Resistivity
  • Low Dielectric Constant
  • RF Switches
  • Integrated Passive Devices (IPDs) 

Brief

The article discusses the advantages of using glass as a material for RF MEMS packaging, particularly for applications in 5G mobile networks. Glass offers desirable properties such as low loss, high resistivity, and a low dielectric constant, making it suitable for high-frequency applications. The article highlights the benefits of glass-based RF MEMS switches, which demonstrate lower insertion loss compared to silicon and other materials. It also explores the use of Through Glass Vias (TGVs) for creating compact, high-performance RF components.

Summary

Here is a TLDR summarization of the article, based on the provided sources:

  • The article highlights the increasing use of glass in radio frequency micro-electro-mechanical systems (RF MEMS), particularly for mobile and 5G applications.
  • Glass offers several advantages:
  1. High resistivity
  2. Low dielectric constant
  3. Low electrical loss
  4. Adjustable coefficient of thermal expansion (CTE)
  5. Cost-effectiveness due to large-scale manufacturing processes.

  • The article discusses the use of Through Glass Vias (TGVs), which are precision holes formed in glass substrates. These vias are metalized and used for electrical interconnects and integrated passive devices (IPDs).
  • Key applications of glass in RF MEMS include:
  1. RF switches: Glass-based RF MEMS switches offer superior performance, particularly at higher frequencies (above 3GHz), due to lower losses compared to traditional silicon or gallium arsenide-based switches.
  2. Antenna tuning: Glass-based solutions provide a better figure of merit (Ron x Coff), leading to more efficient antenna tuning in mobile devices.
  3. Integrated Passive Devices (IPDs): Glass substrates with TGVs allow for the creation of high-Q inductors and capacitors, leading to improved broadband filters and diplexers.
  • The article concludes that glass is becoming a crucial material for advanced packaging in various fields, including high-performance computing and photonics. Its exceptional properties make it ideal for meeting the demands of next-generation technologies, particularly in RF applications where low loss and high frequency performance are paramount.

Origin: https://meridian.allenpress.com/ism/article/2018/1/000680/9518/Glass-Packaging-for-RF-MEMS

Back to blog