Investigating on Through Glass via Based RF Passives for 3-D Integration

Citation

doi: 10.1109/JEDS.2018.2849393* 

Keywords

• Through glass via inductor
• Integrated passive device
• Band-pass filter
• 3-D integration

Brief

This article investigates the use of through glass vias (TGVs) as radio frequency passive components in 3-D integration, demonstrating their advantages in terms of low electrical loss, compact size, and excellent filtering performance, particularly for applications like band-pass filters in wireless communication systems. 

Summary

The article investigates through glass vias (TGVs) as a potential material for radio frequency (RF) passive components in 3-D integration. TGVs have various advantages over traditional silicon vias, such as low electrical loss, low cost, and easier fabrication. The authors investigate the electrical characteristics of TGV inductors, specifically their inductance and quality factor, under the influence of design parameters like TGV diameter, interposer thickness, TGV pitch, number of turns, RDL height, and RDL width. The article reports that TGV inductors demonstrate high inductance and quality factor, making them suitable for RF passive component applications. Furthermore, the article demonstrates the use of TGV inductors and parallel plate capacitors to design a compact 3-D band-pass filter (BPF) for a 2.4-GHz WLAN application. This TGV-based BPF demonstrated a compact size and excellent filtering performance compared to previously reported BPFs.

Origin: https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8391707