Processing Through Glass Via (TGV) Interposers
Citation
Authors: The sources list eight authors for the article.
Year: The sources indicate a likely publication year of 2019.
Title: The sources provide the full title: "Processing Through Glass Via (TGV) Interposers."
Publication: While the exact publication isn't explicitly stated, the consistent use of "DPC" and "2019" across the sources strongly suggests the paper was part of a conference or publication with "DPC" in its name that took place in 2019.
Keywords
- Through-Glass Via (TGV)
- 3D HDI Packaging
- Interposer
- Silicon Scaling
- Packaging Scaling
- Conductive TGV
- ECA Filled Glass Vias
- Cu-Plated TGV
- Diplexer Module
- Semi-Additive Plating (SAP)
- Glass Interposer
Brief
This source contains presentation slides, not a traditional article, and lacks a concise, summarizing sentence. However, one could summarize the key focus as: The presentation discusses the application of Through-Glass Via (TGV) technology in the creation of 3D high-density integrated (HDI) packaging, highlighting its potential to overcome scaling limitations in electronics packaging.
Summary
The sources discuss the advantages of using glass interposers in 3D integrated circuit packaging.
Here's a summary of the key points:
- Silicon scaling in integrated circuits (IC) has significantly outpaced packaging scaling, leading to a need for new packaging technologies like glass interposers. Silicon features have shrunk by 1000x, while packaging features have only shrunk by 3-5x.
- Glass interposers, specifically those using Through Glass Vias (TGV), offer a promising solution for high-density interconnections in advanced packaging.
- Several methods for creating conductive TGVs are discussed, including electrically conductive adhesives and copper plating.
- Research at Binghamton University shows success in creating copper-filled TGVs, highlighting the potential of this approach.
- i3 Electronics, the company behind this research, has a roadmap for developing even more advanced glass interposer technologies. These include finer lines, embedded dies, and integration with other materials like ABF film.
Overall, the sources highlight **the importance of glass interposers in addressing the challenges of packaging increasingly complex integrated circuits.