Progress and application of through glass via (TGV) technology

Progress and application of through glass via (TGV) technology

Citation

Authors: Aric B. Shorey and Rachel Lu
Title: PROGRESS AND APPLICATION OF THROUGH GLASS VIA (TGV) TECHNOLOGY
Year: 2016
Publisher: Corning Incorporated
Conference: IMAPs 48th International Symposium on Microelectronics

Brief

Through glass via (TGV) technology uses the insulating properties of glass and the ability to create vias in it to improve performance and lower costs in various packaging applications, particularly in RF communication and 3D integrated circuits.

Summary

The article "PROGRESS AND APPLICATION OF THROUGH GLASS VIA (TGV) TECHNOLOGY" (2016) by Aric B. Shorey and Rachel Lu explores the potential of Through Glass Via (TGV) technology in advanced semiconductor packaging.

Here are the key takeaways from the article:

  • Benefits of Glass Substrates: The authors highlight the advantages of glass as a packaging material, particularly its low electrical loss at high frequencies, high stiffness, and adjustable coefficient of thermal expansion (CTE). These properties make glass suitable for various applications, including RF communications and 3D-IC stacking
  • TGV Technology and Capabilities: The article describes TGV technology, which involves creating precision vias in glass substrates for electrical interconnects. It also summarizes the current capabilities of this technology, including via size, pitch, and compatibility with wafer and panel formats.
  • Addressing CTE Mismatch in 3D-IC Stacking: One of the critical challenges in 3D-IC stacking is managing the CTE mismatch between different materials, which can lead to reliability issues. Glass interposers with adjustable CTE offer a solution to mitigate warp and enhance reliability in these applications.
  • Superior Electrical Performance of Glass: The article emphasizes the excellent electrical performance of glass, particularly its low electrical loss at high frequencies compared to silicon. This property is crucial for RF applications, where minimizing power loss is essential.
  • Cost-Effectiveness and Large Form Factors: Glass forming processes allow for the production of large-format substrates, enabling cost-effective manufacturing for high-volume applications such as the Internet of Things (IoT). The ability to create ultra-thin glass further enhances cost savings by potentially eliminating grinding and polishing steps.
  • Handling Solutions for Thin Glass: The article discusses handling techniques for ultra-thin glass substrates, including Corning's Advanced Lift-off Technology (ALoT), which involves temporarily bonding the glass to a carrier wafer during processing. This approach allows for via metallization and other processes without damaging the fragile thin glass.

Overall, the article concludes that TGV technology, combined with the inherent benefits of glass, presents a promising solution for next-generation packaging applications.

Origin: https://www.corning.com/media/worldwide/cdt/documents/IMAPs_Corning_TGV_FINAL.pdf

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