Through Glass Via (TGV) Technology for RF Applications
Citation
Shorey, A. B., Kuramochi, S., & Yun, C. H. (2015). Through Glass Via (TGV) Technology for RF Applications. International Symposium on Microelectronics}.
Keywords
- Glass
- Through Glass Via (TGV)
- RF components
- RF passives
Brief
This article discusses the advantages of using glass as a substrate for radio frequency applications and details the fabrication process of a Through Glass Via (TGV) integrated passive device.
Summary
The article, "Through Glass Via (TGV) Technology for RF Applications", published in 2015, explores the use of glass as a substrate for radio frequency (RF) components, specifically focusing on the fabrication and advantages of Through Glass Via (TGV) technology for creating high-performance inductors and capacitors.
Here are the key takeaways from the article:
- Glass is an ideal substrate for RF components due to its superior insulating properties, low electrical loss, and cost-effectiveness. These properties enable the achievement of high Q-factors, crucial for filter applications in RF front ends.
- TGV technology enables the creation of 3D inductors with improved performance compared to traditional 2D planar inductors. The article outlines the TGV fabrication process, involving the creation of vias in glass substrates, followed by metallization to form conductive pathways.
- The integration of Cu Metal-Insulator-Metal (MIM) capacitors on TGV substrates further enhances the functionality and performance of RF components. This integration allows for the creation of compact and highly efficient LC networks suitable for various RF applications.
- The authors successfully demonstrate the fabrication of TGV-based inductors and capacitors, highlighting the process flow and materials used. They also provide insights into the electrical and mechanical reliability of these components, emphasizing their suitability for demanding RF applications.
Overall, the article emphasizes the potential of TGV technology in advancing RF component design and performance by leveraging the unique properties of glass substrates.