Reduction Temperature-Dependent Nanoscale Morphological Transformation and Electrical Conductivity of Silicate Glass Microchannel Plate

Reduction Temperature-Dependent Nanoscale Morphological Transformation and Electrical Conductivity of Silicate Glass Microchannel Plate

Citation

Cai, H.; Sun, Y.; Zhang, X.; Zhang, L.; Liu, H.; Li, Q.; Bo, T.; Zhou, D.; Wang, C.; Lian, J. Reduction Temperature-Dependent Nanoscale Morphological Transformation and Electrical Conductivity of Silicate Glass Microchannel Plate. Materials , 12, 1183. 

 

Brief

The bulk resistance of microchannel plates (MCPs) has a BiDoseResp trend dependence on hydrogen reduction temperature due to the relationship between bulk resistance and the spacing of conducting nano-islands in lead silicate glass. 

Summary

The study investigated how the temperature of hydrogen reduction affects the nanoscale morphology and electrical conductivity of lead silicate glass, a key material in microchannel plates (MCPs).

  • Researchers found that both the bulk resistance of MCPs and the spacing of lead (Pb) atom aggregates on the glass surface exhibited a BiDoseResp trend dependence on the hydrogen reduction temperature.
  • This means that as the reduction temperature increased, both the bulk resistance and spacing initially decreased, reached a minimum, and then gradually increased.
  • The optimal reduction temperature for achieving the lowest bulk resistance and spacing was determined to be around 685 K.
  • The study concluded that the electrical conductivity of the MCPs was influenced by the morphology of the conductive phases, specifically the spacing of Pb-islands formed during reduction.
  • A larger spacing between these islands led to a higher bulk resistance, likely due to increased hopping distances for electrons.

The authors suggest that these findings provide a deeper understanding of the relationship between the hydrogen reduction process, nanoscale morphology, and electrical properties of lead silicate glass in MCPs. This knowledge could contribute to optimizing the fabrication processes of MCPs for improved performance.

Origin: https://www.semanticscholar.org/reader/191f2b4bfc7d8edcf9dcdf200d642bb7d9aa6232

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