Advancements in Through Glass Via (TGV) Technology

Citation

Shorey, Aric. "Advancements in Through Glass Via (TGV) Technology." IMAPS 11th International Conference on Device Packaging, 18 Mar. 2015, Fountain Hills, AZ. IMAPS, http://meridian.allenpress.com/imaps-conferences/article-pdf/2015/DPC/001343/2262569/2015dpc-wp11.pdf. Accessed 3 Jan. 2023. 

Keywords

• Through Glass Via (TGV)
• Glass Interposer
• Reliability
• Thermal Cycling
• Metallization
• CTE (Coefficient of Thermal Expansion)
• Applications 

Brief

This article discusses the advancements in Through Glass Via (TGV) technology, highlighting its advantages, applications, and future development. 

Summary

This article, presented by Aric Shorey at the IMAPS 11th International Conference on Device Packaging in 2015, discusses advancements in Through Glass Via (TGV) technology. The article highlights the advantages of using glass for via formation, such as low electrical loss, customizable CTE, stiffness, and the potential for smaller package size and cost savings.

Here are some key takeaways:

• The presentation outlines Corning's current design rules for TGV, covering aspects like via size, pitch, glass dimensions, and thickness.
• It showcases progress in metallization and reliability testing of TGV, including various via filling techniques and promising results from thermal cycle tests.
• The author presents findings from biased HAST testing, indicating that while high CTE glass showed a reduction in resistance due to copper migration, a Si3N4 barrier layer proved effective in mitigating this issue.
• The presentation highlights collaborations with Atotech and Fraunhofer IZM for glass metallization, noting the use of a new adhesion promoter. It also mentions Fraunhofer IZM's characterization of glass parameters up to 70 GHz.
• The author discusses failure analysis results, revealing that while most daisy chains passed rigorous thermal cycling, some delamination of the Redistribution Layer (RDL) line was observed. However, the copper vias themselves remained intact, showcasing their robust adhesion to the glass.
• The presentation emphasizes the high reliability of TGVs in glass, particularly after thermal shock, with stable performance observed up to 40 GHz.
• The author concludes by highlighting the advantages of glass core substrates, particularly their stiffness and CTE adjustability, which contribute to improved package reliability.

The presentation concludes by outlining Corning's future plans, which include further development of the TGV process, exploration of applications in RF and interposer/substrate technologies, and continued efforts to mature the supply chain. 

Origin: https://www.semanticscholar.org/paper/Advancements-in-Through-Glass-Via-(TGV)-Technology-Shorey-Lu/752053506832b90ac25e8572fd316d04aa43127d