Design of Power/Ground Noise Suppression Structures Based on a Dispersion Analysis for Packages and Interposers with Low-Loss Substrates
Citation
Kim, Y. Design of Power/Ground Noise Suppression Structures Based on a Dispersion Analysis for Packages and Interposers with Low-Loss Substrates. Micromachines 2022, 13, 1433.
Keywords
- electromagnetic bandgap (EBG)
- interposers
- low-loss substrates
- noise suppression structures
- packages
- power delivery network (PDN)
- power/ground noise
Brief
This article presents a design for power/ground noise suppression structures for packages and interposers with low-loss substrates and experimentally validates its efficacy.
Summary
This article focuses on the design of structures that suppress power/ground noise in packages and interposers using low-loss substrates, such as glass.
- Low-loss substrates are beneficial for high-speed signal integrity, but they don't inherently suppress power/ground noise, leading to problems like crosstalk and other power integrity issues.
- This article proposes the use of electromagnetic bandgap (EBG) structures embedded in the power delivery network (PDN) as a solution to this problem.
- These EBG structures, according to the article, offer a more effective and compact alternative to traditional decoupling capacitor arrays.
- The article outlines a dispersion analysis method for designing these noise suppression structures.The authors claim this method is more efficient than full electromagnetic simulations, especially during the initial design phases.
- The effectiveness of the proposed method and the EBG structures is validated through experimental measurements and simulations using fabricated glass interposer test vehicles.
- The results demonstrate that the designed EBG structures successfully suppress power/ground noise propagation within the targeted frequency bands.
- The article suggests that the proposed design approach can be extended to other low-loss materials besides glass.
The authors conclude that while the proposed EBG structures are effective, further research is needed to explore more cost-effective designs due to the increased fabrication costs associated with the additional metal layers required for the EBG structures.