Miniaturised wideband bandpass filter with good selectivity based on 3D heterogeneous integrated passive device technology

Miniaturised wideband bandpass filter with good selectivity based on 3D heterogeneous integrated passive device technology

Citation

Zhou, Y., et al.: Miniaturised wideband bandpass filter with good selectivity based on 3D heterogeneous integrated passive device technology. IET Microw. Antennas Propag. 18(4), 266–271 (2024). https://doi.org/10.1049/mia2.12447

Keywords

  • 5G mobile communication
  • integrated circuit design
  • microwave devices
  • wideband bandpass filter
  • 3D heterogeneous integrated passive device technology
  • frequency selectivity
  • wide stopband
  • GaAs-based
  • Glass-based
  • micro-nano-scale processes
  • quality factors
  • insertion loss
  • transmission zeros (TZs)
  • heterogeneous integration
  • flip chip bonding
  • ball grid array (BGA)
  • through-glass-via (TGV)

Brief

This article presents a miniaturized wideband bandpass filter with good frequency selectivity and a wide stopband designed using 3D heterogeneous integrated passive device technology.

Summary

The article presents a novel design for a miniaturized wideband bandpass filter (BPF) that exhibits good frequency selectivity and a wide stopband using 3D heterogeneous integrated passive device (IPD) technology. This technology integrates components on both GaAs and Glass substrates for enhanced performance.

Here's a breakdown of the key aspects:

  • Problem: Traditional methods for designing wideband BPFs face limitations in achieving compact size, low insertion loss, high frequency selectivity, and a wide stopband. Existing techniques for improving these aspects often lead to increased size and loss.
  • Solution: The proposed BPF utilizes a sixth-order highpass-lowpass topology implemented through 3D heterogeneous integration. This involves combining 3D spiral inductors on a Glass substrate with high-density capacitors on a GaAs substrate.
  • Advantages:
    1. Compact Size: The filter's area is only 0.014 × 0.018 λ0<sup>2</sup> (1.1 × 1.42 mm<sup>2</sup>), making it suitable for high-density integration.
    2. Good Selectivity: The design incorporates multiple transmission zeros (TZs) near the passband, enhancing selectivity and stopband rejection.
    3. Low Loss: 3D spiral inductors on Glass exhibit higher Q-factors compared to traditional planar inductors, resulting in lower insertion loss.
  • Fabrication and Results: The BPF was fabricated and tested, demonstrating a center frequency of 3.875 GHz, a 3-dB fractional bandwidth (FBW) of 42%, and 20-dB rejection ranging from 5.22 to 20 GHz (5.15 f0). The measured results closely matched the simulated performance.

In conclusion, this research introduces a promising approach for developing miniaturized, high-performance wideband BPFs for applications in advanced wireless communication systems, such as 5G equipment, where compactness and signal filtering are crucial.

Origin: https://ietresearch.onlinelibrary.wiley.com/doi/full/10.1049/mia2.12447

Back to blog