Nonlinear multiphoton modification of glass substrates for fabrication of high aspect ratio through-glass vias
Citation
Lee, M.-K., Yu, J.-Z., Chang, H.-Y., Chang, C.-Y., Liu, C.-S., & Lin, P.-C. (2022). Nonlinear multiphoton modification of glass substrates for fabrication of high aspect ratio through-glass vias. AIP Advances, 12(5), 055011. https://doi.org/10.1063/5.0086879
Keywords
- Through-Glass Vias (TGVs)
- Nonlinear Multiphoton Modification
- Picosecond Laser
- High Aspect Ratio
- Taper Angle
- Glass Interposer
- 3D-IC Packaging
- Metallization
- Bessel Beam
- Deep Etching
Brief
This article presents a method for creating through-glass vias (TGVs) on glass substrates using a nonlinear multiphoton-assisted modification process with a picosecond laser, achieving a high aspect ratio (1:10) and a taper angle of approximately 2°.
Summary
This article presents a new method for creating through-glass vias (TGVs) in glass substrates, which are used in 3D-IC designs. The method involves using a picosecond laser to modify the glass substrate. This modification makes the areas hit by the laser etch faster than the unmodified areas. The article details the experimental setup, the glass modification mechanism, and the fabrication process.
The researchers successfully created TGVs with a high aspect ratio of 1:10 and a taper angle of ~2°. The article concludes that this method is cost-effective and produces high-quality TGVs suitable for industrial applications.