Thin Glass Substrates with Through-Glass Vias
Citation
Title: Thin Glass Substrates with Through-Glass Vias.
Authors: Aric Shorey*, Shelby Nelson, David Levy and Paul Ballentine
Organization: Mosaic Microsystems
Location: 500 Lee Road Rochester, NY 14606 USA
Contact: Ph: 585-456-4268 Email: aric.shorey@mosaicmicro.com*
Keywords
- Glass substrates
- Through-glass vias (TGVs)
- System in a package (SIP)
- Millimeter wave (mmW) applications
- RF properties
- Dimensional stability
- Temporary bonding technology
- Semiconductor fabrication
- Packaging materials
- High-speed digital interposers
- Integrated photonics
- MEMs and Sensors
Brief
This article discusses the advantages of glass as a packaging material for microelectronics, particularly its suitability for high-frequency applications like 5G and its potential to overcome existing manufacturing challenges through innovative temporary bonding technology.
Summary
The article, "Thin Glass Substrates with Through-Glass Vias," explores the potential of using thin glass substrates in microelectronics packaging, especially for millimeter wave applications.
Here are some key takeaways from the article:
- Advantages of Glass Substrates: Glass offers several advantages over traditional packaging materials like organic laminates, ceramics, and silicon. These advantages include superior RF properties, dimensional stability, smooth surfaces, transparency from visible to IR wavelengths, inertness, and cost-effectiveness.
- Applications of Glass Substrates: The article discusses various applications for glass substrates, including high-speed digital interposers, RF applications (especially in 5G and millimeter wave technology), photonics, and MEMS/sensors.
- Challenges and Solutions for Thin Glass Handling: A key challenge in adopting glass substrates is the difficulty in handling thin glass during manufacturing. The article highlights Mosaic Microsystems' solution: temporarily bonding the glass to a carrier wafer (usually silicon). This enables the use of standard semiconductor fabrication equipment without the risk of damage or contamination.
- Mosaic's Temporary Bonding Technology: The bonding process utilizes an inorganic adhesive that allows for high-temperature processing and easy mechanical de-bonding after fabrication. This approach avoids the outgassing issues associated with organic bonding materials used in traditional TSV processing.
- Benefits of Mosaic's Approach:
- Compatibility with Existing Infrastructure: By using a silicon carrier, the process integrates seamlessly with current semiconductor fabrication equipment.
- Cost Savings: Eliminates the need for expensive back-grinding and polishing operations.
- Enhanced Integration: Allows for multi-layer lamination and integration of passive devices.
- Conclusion: The article concludes that glass is a promising material for next-generation packaging, particularly for high-volume applications like 5G and millimeter wave technologies. Mosaic's temporary bonding technology addresses the handling challenges associated with thin glass, paving the way for wider adoption.