ガラスコア基板

Reliability and Lifetime Assessment of Through-...

Citation Viljanto, H. (2015). Reliability and Lifetime Assessment of Through-Silicon Vias Under Thermal Cycling (Master's thesis, Aalto University, School of Electrical Engineering).  Through-Silicon Via (TSV) Reliability Thermal Cycling Failure Mechanisms...

Micro-Hole Drilling on Glass Substrates—A Review

Citation Hof, L. A., & Ziki, J. A. (2017). Micro-hole drilling on glass substrates—A review. Micromachines, 8(2), 53. https://doi.org/10.3390/mi8020053 Keywords micro-drilling techniques glass micro-devices micro-fluidics MEMS Brief This article is...

A Fully Integrated Solid-State Charge Detector ...

Citation Wu, X.; Wen, L.; Cao, L.; Cao, G.; Li, G.; Fu, Y.; Yu, Z.; Fang, Z.; Wang, Q. A Fully Integrated Solid-State Charge Detector with through Fused Silica Glass...

A metal oxide adhesion layer prepared with wate...

Citation Liu, Z., Hunegnaw, S., Fu, H., Wang, J., Magaya, T., Merschky, M., Bernhard, T., Shorey, A., & Yun, H. (2015). A metal oxide adhesion layer prepared with water based...

Thin Glass Handling Solutions for Microelectron...

Citation Shorey, Aric, Shelby Nelson, David Levy, and Paul Ballentine. "Thin Glass Handling Solutions for Microelectronics Packaging." International Symposium on Microelectronics, 2020, pp. 1-7. Keywords Glass Substrates Through-Glass Vias (TGV)...

Characterization and Electrical Performance of ...

Citation Woychik, C., Lauffer, J., Pollard, S., Parmar, R., Gaige, M., Wilson, W., Carey, J., Neely, M., Ling, F., & Chen, L. (2019). Characterization and Electrical Performance of Glass Diplexer...