ガラスコア基板

Novel glass substrates for minimizing thermal s...

Citation *Nomura, S., Sawamura, S., Hanawa, Y., Sakai, Y., & Hayashi, K. (2016). Novel glass substrates for minimizing thermal stress development during electronic device packaging process. , 2016, 607-617. CTE control...

Nanocrystalline diamond-glass platform for the ...

Citation Janssens, S. D., Vázquez-Cortés, D., Giussani, A., Kwiecinski, J. A., & Fried, E. (2019). Nanocrystalline diamond-glass platform for the development of three-dimensional micro- and nanodevices. Diamond & Related Materials,...

Design and Demonstration of Glass Panel Embeddi...

Citation Ravichandran, S., Yamada, S., Ogawa, T., Shi, T., Liu, F., Smet, V., Sundaram, V., & Tummala, R. (2019). Design and Demonstration of Glass Panel Embedding for 3D System Packages...

Glass Packaging for RF MEMS

Citation Parmar, R., & Zhang, J. (2018). Glass Packaging for RF MEMS. International Symposium on Microelectronics. Keywords Glass Packaging RF MEMS 5G Mobile Networks Through Glass Vias (TGVs) Low Loss...

Fabrication and characterization of advanced th...

Citation Authors: Timothy Clingenpeel, Arian Rahimi, Seahee Hwangbo, Yong-Kyu Yoon, and Aric ShoreyTitle: Fabrication and characterization of advanced through glass via interconnectsConference: Proceedings of the International Symposium on Microelectronics (ISOM)Year:...

Cu diffusion into the glass under bias temperat...

Citation Kim, H., Cai, L., Fahey, A., Vaddi, R., Zhu, B., & Mazumder, P. (2018). Cu diffusion into the glass under bias temperature stress condition for through glass vias (TGV)...