Novel design concept of an optoelectronic integrated RF communication module

Novel design concept of an optoelectronic integrated RF communication module

Citation

Q. H. Dao, A. Skubacz-Feucht, B. Lüers, P. von Witzendorff, C. von der Ahe, L. Overmeyer, et al., "Novel design concept of an optoelectronic integrated RF communication module," Procedia Technology, vol. 26, pp. 245-251, 2016.

Keywords

  • 24 GHz RFID
  • Wireless sensor node
  • RF communication
  • 3D-MID
  • Optoelectronic packaging
  • Optical power transfer

Brief

This article presents a novel design concept for a miniaturized 24 GHz radio frequency communication module that can be integrated into metallic workpieces and powered wirelessly using an energy harvesting concept.

Summary

The 2016 Procedia Technology article "Novel design concept of an optoelectronic integrated RF communication module" by Dao et al. describes the design of a small (13 x 13 x 4 mm³) radio frequency (RF) communication module for integration into metallic components. The module is intended to be used as a wireless sensor node and operates in the 24 GHz industrial, scientific, and medical (ISM) radio band, enabling high data transmission and reduced latency.

Here are some key features of the module design:

  • Optical Power Supply: The module utilizes an energy harvesting concept consisting of a highly efficient multijunction solar cell (40% efficiency at 50 W/cm²) and a supercapacitor for energy storage. This design eliminates the need for batteries and allows the system to operate throughout the product lifecycle.
  • 3D-MID Housing: The module housing is designed using three-dimensional molded interconnect devices (3D-MID) technology, which enables the integration of electrical and optical components in a compact multi-layer structure. Laser direct structuring (LDS) is used to create conductive paths on the plastic housing, allowing for the connection of the various components.
  • RF Circuit and Antenna: The RF circuit, including a patch antenna designed for optical transparency, is placed on top of the solar cell. The antenna and analog frontend are fabricated on a quartz glass substrate chosen for its high optical transparency and low dissipation factor.
  • Microcontroller and Sensors: The module incorporates a low-power microcontroller (Texas Instruments MSP430FR5738) for data processing and communication. The microcontroller has an I²C bus that enables the connection of additional sensors, such as temperature or strain sensors, to expand the module's functionality.

Testing showed that the module could operate continuously for 13.9 minutes on a fully charged supercapacitor in a low ambient light environment while transmitting data every second. The authors conclude that this design presents a promising approach for integrating wireless communication and sensing capabilities into metallic components, enabling applications in product lifecycle management and process monitoring.

Origin: https://www.sciencedirect.com/science/article/pii/S2212017316303802

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