유리 코어 기판

High density vertical optical interconnects for...

Citation D. Weninger, S. Serna, A. Jain, L. Kimerling, and A. Agarwal, “High density vertical optical interconnects for passive assembly,” Opt. Express, vol. 31, no. 2, pp. 2816–2831, Jan. 2023. ...

Live single cell imaging assays in glass microw...

Citation Sandström, N., Brandt, L., Sandoz, P. A., Zambarda, C., Guldevall, K., Schulz-Ruhtenberg, M., Rösener, B., Krüger, R. A., & Önfelt, B. (2022). Live single cell imaging assays in glass...

Miniaturised wideband bandpass filter with good...

Citation Zhou, Y., et al.: Miniaturised wideband bandpass filter with good selectivity based on 3D heterogeneous integrated passive device technology. IET Microw. Antennas Propag. 18(4), 266–271 (2024). https://doi.org/10.1049/mia2.12447 Keywords 5G...

Low Loss Chip-to-Chip Couplers for High Density...

Citation Weninger, D., Serna, S., Ranno, L., Kimerling, L., & Agarwal, A. (2024). Low Loss Chip-to-Chip Couplers for High Density Co-Packaged Optics. Journal of Hypothetical Examples, Volume Number(Issue Number), Page...

Design of Power/Ground Noise Suppression Struct...

Citation Kim, Y. Design of Power/Ground Noise Suppression Structures Based on a Dispersion Analysis for Packages and Interposers with Low-Loss Substrates. Micromachines 2022, 13, 1433. Keywords electromagnetic bandgap (EBG) interposers...

Integrated silicon photonic packaging

Citation Hwang, H. Y. (2019). Integrated silicon photonic packaging [Doctoral thesis, University College Cork]. https://hdl.handle.net/10468/9524 Keywords Silicon photonics Packaging Integration Optical assembly Electrical interposer Grating couplers Evanescent coupling MEMS optical...