Glass Core Substrate
Study of Through Glass Via (TGV) Using Bessel B...
Citation Kim, J.; Kim, S.; Kim, B.; Choi, J.; Ahn, S. Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching. Micromachines 2023,...
Study of Through Glass Via (TGV) Using Bessel B...
Citation Kim, J.; Kim, S.; Kim, B.; Choi, J.; Ahn, S. Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching. Micromachines 2023,...
Glass Package and Through Glass Via (TGV) for MEMS
Citation Author: Aric B. Shorey, PhDTitle: "Glass Package and Through Glass Via (TGV) for MEMS"Subtitle: "Enabling the electrification of everything Milliwatts-to-kilowatts, DC-to-light" Keywords Menlo Microsystems Ideal Switch MEMS Glass Substrates...
Glass Package and Through Glass Via (TGV) for MEMS
Citation Author: Aric B. Shorey, PhDTitle: "Glass Package and Through Glass Via (TGV) for MEMS"Subtitle: "Enabling the electrification of everything Milliwatts-to-kilowatts, DC-to-light" Keywords Menlo Microsystems Ideal Switch MEMS Glass Substrates...
Chalcogenide Glass Hollow-Core Microstructured ...
Citation Shiryaev VS (2015) Chalcogenide glass hollow-core microstructured optical fibers. Front. Mater. 2:24. doi: 10.3389/fmats.2015.00024 Keywords chalcogenide glass hollow-core microstructured optical fibers (HC-MOFs) mid-infrared (IR) optical losses negative curvature photonic...
Chalcogenide Glass Hollow-Core Microstructured ...
Citation Shiryaev VS (2015) Chalcogenide glass hollow-core microstructured optical fibers. Front. Mater. 2:24. doi: 10.3389/fmats.2015.00024 Keywords chalcogenide glass hollow-core microstructured optical fibers (HC-MOFs) mid-infrared (IR) optical losses negative curvature photonic...
Fabrication of Panel-Level Glass Substrates wit...
Citation Authors: Rafael Santos, Nils Anspach, Norbert Ambrosius, Stephan Schmidt, Roman OstholtPublisher: LPKF Laser & Electronics AG Keywords Laser Induced Deep Etching (LIDE) Through-Glass Vias (TGVs) Interposer Glass Silicon Semiconductor...
Fabrication of Panel-Level Glass Substrates wit...
Citation Authors: Rafael Santos, Nils Anspach, Norbert Ambrosius, Stephan Schmidt, Roman OstholtPublisher: LPKF Laser & Electronics AG Keywords Laser Induced Deep Etching (LIDE) Through-Glass Vias (TGVs) Interposer Glass Silicon Semiconductor...
Glass-Core Substrates for RF Heterogeneous Inte...
Citation Ketterson, A., Chen, S., Pandey, R., Chiu, A., El Bouanani, L., Hitt, J., Yun, Y., Kim, Y. R., Anderson, K., & Ashby, K. (2023, October 2-5). Glass-Core Substrates for...
Glass-Core Substrates for RF Heterogeneous Inte...
Citation Ketterson, A., Chen, S., Pandey, R., Chiu, A., El Bouanani, L., Hitt, J., Yun, Y., Kim, Y. R., Anderson, K., & Ashby, K. (2023, October 2-5). Glass-Core Substrates for...