Glass Core Substrate
Advancements in Through Glass Via (TGV) Technology
Citation Shorey, Aric. "Advancements in Through Glass Via (TGV) Technology." IMAPS 11th International Conference on Device Packaging, 18 Mar. 2015, Fountain Hills, AZ. IMAPS, http://meridian.allenpress.com/imaps-conferences/article-pdf/2015/DPC/001343/2262569/2015dpc-wp11.pdf. Accessed 3 Jan. 2023. Keywords...
Advancements in Through Glass Via (TGV) Technology
Citation Shorey, Aric. "Advancements in Through Glass Via (TGV) Technology." IMAPS 11th International Conference on Device Packaging, 18 Mar. 2015, Fountain Hills, AZ. IMAPS, http://meridian.allenpress.com/imaps-conferences/article-pdf/2015/DPC/001343/2262569/2015dpc-wp11.pdf. Accessed 3 Jan. 2023. Keywords...
Through-Glass-Via Enabling Low Loss High-Linear...
Citation Liljeholm, J., Shah, U., Campion, J., Ebefors, T., Oberhammer, J. (2016) Through-Glass-Via Enabling Low Loss High-Linearity RF Components. In: N.B. When citing this work, cite the original published paper.The...
Through-Glass-Via Enabling Low Loss High-Linear...
Citation Liljeholm, J., Shah, U., Campion, J., Ebefors, T., Oberhammer, J. (2016) Through-Glass-Via Enabling Low Loss High-Linearity RF Components. In: N.B. When citing this work, cite the original published paper.The...
A Novel Sealing Redistribution Layer Approach f...
Citation Article Title: A Novel Sealing Redistribution Layer Approach for Through-Glass via FabricationAuthors: Shih-Wei Lee, Geng-Ming Chang, Ching-Yun Chang, and Kuan-Neng ChenJournal: IEEE Transactions on Electron DevicesDigital Object Identifier (DOI):...
A Novel Sealing Redistribution Layer Approach f...
Citation Article Title: A Novel Sealing Redistribution Layer Approach for Through-Glass via FabricationAuthors: Shih-Wei Lee, Geng-Ming Chang, Ching-Yun Chang, and Kuan-Neng ChenJournal: IEEE Transactions on Electron DevicesDigital Object Identifier (DOI):...
Progress and application of through glass via (...
Citation Authors: Aric B. Shorey and Rachel LuTitle: PROGRESS AND APPLICATION OF THROUGH GLASS VIA (TGV) TECHNOLOGYYear: 2016Publisher: Corning IncorporatedConference: IMAPs 48th International Symposium on Microelectronics Through Glass Via (TGV) Glass Interposer RF Applications 3D-IC...
Progress and application of through glass via (...
Citation Authors: Aric B. Shorey and Rachel LuTitle: PROGRESS AND APPLICATION OF THROUGH GLASS VIA (TGV) TECHNOLOGYYear: 2016Publisher: Corning IncorporatedConference: IMAPs 48th International Symposium on Microelectronics Through Glass Via (TGV) Glass Interposer RF Applications 3D-IC...
Investigating on Through Glass via Based RF Pas...
Citation doi: 10.1109/JEDS.2018.2849393* Keywords Through glass via inductor Integrated passive device Band-pass filter 3-D integration Brief This article investigates the use of through glass vias (TGVs) as radio frequency passive...
Investigating on Through Glass via Based RF Pas...
Citation doi: 10.1109/JEDS.2018.2849393* Keywords Through glass via inductor Integrated passive device Band-pass filter 3-D integration Brief This article investigates the use of through glass vias (TGVs) as radio frequency passive...
Reliability Assessment of Thermocompressed Epox...
Citation Wang, S.-H.; Hsu, W.; Liou, Y.-Y.; Huang, P.-C.; Lee, C.-C. Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach. Materials 2022, 15, 7357. https://doi.org/10.3390/ma15207357 Keywords...
Reliability Assessment of Thermocompressed Epox...
Citation Wang, S.-H.; Hsu, W.; Liou, Y.-Y.; Huang, P.-C.; Lee, C.-C. Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach. Materials 2022, 15, 7357. https://doi.org/10.3390/ma15207357 Keywords...