유리 코어 기판
Ultra-Wideband Capacitive Micromachined Ultraso...
Citation Adelegan, O. J. (2020). Ultra-wideband capacitive micromachined ultrasonic transducers (CMUTs) and through-wafer interconnects for applications in immersion and air [Doctoral dissertation, North Carolina State University]. Capacitive Micromachined Ultrasonic Transducers...
Ultra-Wideband Capacitive Micromachined Ultraso...
Citation Adelegan, O. J. (2020). Ultra-wideband capacitive micromachined ultrasonic transducers (CMUTs) and through-wafer interconnects for applications in immersion and air [Doctoral dissertation, North Carolina State University]. Capacitive Micromachined Ultrasonic Transducers...
Perspectives of reactive ion etching of silicat...
Citation Weigel, C., Brokmann, U., Hofmann, M., Behrens, A., Rädlein, E., Hoffmann, M., Strehle, S., & Sinzinger, S. (2021). Perspectives of Reactive Ion Etching of Silicate Glasses for Optical Microsystems....
Perspectives of reactive ion etching of silicat...
Citation Weigel, C., Brokmann, U., Hofmann, M., Behrens, A., Rädlein, E., Hoffmann, M., Strehle, S., & Sinzinger, S. (2021). Perspectives of Reactive Ion Etching of Silicate Glasses for Optical Microsystems....
3D Integrated High-Precision Passives on Thin G...
Citation Z. Wu, J. Min, M.R. Pulugurtha, S. Ravichandran, V. Sundaram, and R.R. Tummala, “3D Integrated High-Precision Passives on Thin Glass Substrates for Miniaturized and High-Performance RF Components,” Journal of...
3D Integrated High-Precision Passives on Thin G...
Citation Z. Wu, J. Min, M.R. Pulugurtha, S. Ravichandran, V. Sundaram, and R.R. Tummala, “3D Integrated High-Precision Passives on Thin Glass Substrates for Miniaturized and High-Performance RF Components,” Journal of...
Microfabrication and Integration Using Sub-Pico...
Citation Laakso, Miku. Microfabrication and Integration Using Sub-Picosecond Laser Pulses and Magnetic Assembly. Doctoral Thesis, KTH Royal Institute of Technology, Stockholm, Sweden, 2020. TRITA-EECS-AVL-2020:10. ISBN 978-91-7873-430-6. Keywords Microfabrication Integration Sub-picosecond...
Microfabrication and Integration Using Sub-Pico...
Citation Laakso, Miku. Microfabrication and Integration Using Sub-Picosecond Laser Pulses and Magnetic Assembly. Doctoral Thesis, KTH Royal Institute of Technology, Stockholm, Sweden, 2020. TRITA-EECS-AVL-2020:10. ISBN 978-91-7873-430-6. Keywords Microfabrication Integration Sub-picosecond...
Glass 3D Solenoid Inductors IPD Substrate Manuf...
Citation Chun-Hsien Chien, Yu-Hua Chen, Yu-Chung Hsieh, Wei-Ti Lin, Chien-Chou Chen, Dyi-Chung Hu, Tzvy-Jang Tseng, and Ravi Shenoy. “Glass 3D Solenoid Inductors IPD Substrate Manufacturing Assembly and Characterization." 2016 International...
Glass 3D Solenoid Inductors IPD Substrate Manuf...
Citation Chun-Hsien Chien, Yu-Hua Chen, Yu-Chung Hsieh, Wei-Ti Lin, Chien-Chou Chen, Dyi-Chung Hu, Tzvy-Jang Tseng, and Ravi Shenoy. “Glass 3D Solenoid Inductors IPD Substrate Manufacturing Assembly and Characterization." 2016 International...
Study Photo Imagable dielectric (PID) and non-P...
Citation *Chun-Hsien Chien, Chien-Chou Chen, Wen-Liang Yeh, Wei-Ti Lin, Cheng-Hui Wu, Fu-Yang Chen, Yi-Cheng Lin, Po-Chiang Wang, Jeng-Ting Li, Bo Cheng Lin, Yu-Hua Chen, Tzyy-Jang Tseng. "Study Photo Imagable dielectric...
Study Photo Imagable dielectric (PID) and non-P...
Citation *Chun-Hsien Chien, Chien-Chou Chen, Wen-Liang Yeh, Wei-Ti Lin, Cheng-Hui Wu, Fu-Yang Chen, Yi-Cheng Lin, Po-Chiang Wang, Jeng-Ting Li, Bo Cheng Lin, Yu-Hua Chen, Tzyy-Jang Tseng. "Study Photo Imagable dielectric...