Glass Core Substrate
Demonstration of Embedded Cu Trench RDL using P...
Citation Sundaram, V., Liu, F., Nair, C., Tummala, R., Kubo, A., Ando, T., Best, K., & Shay, C. (2017). Demonstration of Embedded Cu Trench RDL using Panel Scale Lithography and...
Demonstration of Embedded Cu Trench RDL using P...
Citation Sundaram, V., Liu, F., Nair, C., Tummala, R., Kubo, A., Ando, T., Best, K., & Shay, C. (2017). Demonstration of Embedded Cu Trench RDL using Panel Scale Lithography and...
Addressing Next Generation Packaging and IoT wi...
Citation Shorey, Aric, Rachel Lu, Kevin Adriance, and Gene Smith. “Addressing Next Generation Packaging and IoT with Glass Solutions.” International Symposium on Microelectronics, 2016.The article was published in the proceedings...
Addressing Next Generation Packaging and IoT wi...
Citation Shorey, Aric, Rachel Lu, Kevin Adriance, and Gene Smith. “Addressing Next Generation Packaging and IoT with Glass Solutions.” International Symposium on Microelectronics, 2016.The article was published in the proceedings...
Glass Solutions for Packaging and IoT
Citation Lu, Rachel, and Aric Shorey. “Glass Solutions for Packaging and IoT.” Proceedings of the 48th International Symposium on Microelectronics, 2017, pp. 473–78. Keywords Glass Through Glass Via (TGV) ...
Glass Solutions for Packaging and IoT
Citation Lu, Rachel, and Aric Shorey. “Glass Solutions for Packaging and IoT.” Proceedings of the 48th International Symposium on Microelectronics, 2017, pp. 473–78. Keywords Glass Through Glass Via (TGV) ...
Leveraging Glass Properties for Advanced Packaging
Citation A. B. Shorey, Y. J. Lu, and G. A. Smith, "Leveraging Glass Properties for Advanced Packaging," 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp. 370–375. Keywords...
Leveraging Glass Properties for Advanced Packaging
Citation A. B. Shorey, Y. J. Lu, and G. A. Smith, "Leveraging Glass Properties for Advanced Packaging," 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, pp. 370–375. Keywords...
RF Glass Technology Is Going Mainstream: Review...
Citation T. Chaloun et al., "RF Glass Technology Is Going Mainstream: Review and Future Applications", IEEE J. Microw, vol. 3, no. 2, pp. 139-162, Apr. 2023, doi: 10.1109/JMW.2023.3256413. Keywords MTT...
RF Glass Technology Is Going Mainstream: Review...
Citation T. Chaloun et al., "RF Glass Technology Is Going Mainstream: Review and Future Applications", IEEE J. Microw, vol. 3, no. 2, pp. 139-162, Apr. 2023, doi: 10.1109/JMW.2023.3256413. Keywords MTT...
128 × 128 silicon photonic MEMS switch package ...
Citation Hwang, H. Y., Morrissey, P., Lee, J. S., Brien, P. O., Henriksson, J., Wu, M. C. and Seok, T. J. (2017) '128 × 128 silicon photonic MEMS switch package...
128 × 128 silicon photonic MEMS switch package ...
Citation Hwang, H. Y., Morrissey, P., Lee, J. S., Brien, P. O., Henriksson, J., Wu, M. C. and Seok, T. J. (2017) '128 × 128 silicon photonic MEMS switch package...