Glass Core Substrate
Comparative Analysis of Thermal Properties in M...
Citation Huang, T.-J.; Kiebala, T.; Suflita, P.; Moore, C.; Housser, G.; McMahon, S.; Puchades, I. Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil...
Comparative Analysis of Thermal Properties in M...
Citation Huang, T.-J.; Kiebala, T.; Suflita, P.; Moore, C.; Housser, G.; McMahon, S.; Puchades, I. Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil...
Induced hydraulic pumping via integrated submic...
Citation Cao, Z., & Yobas, L. (2014). Induced hydraulic pumping via integrated submicrometer cylindrical glass capillaries. Electrophoresis, 35(15-16), 2353–2360. Keywords Capillary Chromatography Microfluidics Micropump Surface charge Brief Researchers demonstrate a...
Induced hydraulic pumping via integrated submic...
Citation Cao, Z., & Yobas, L. (2014). Induced hydraulic pumping via integrated submicrometer cylindrical glass capillaries. Electrophoresis, 35(15-16), 2353–2360. Keywords Capillary Chromatography Microfluidics Micropump Surface charge Brief Researchers demonstrate a...
A Handling Solution for Easy Processing of Thin...
Citation Authors: Shelby F. Nelson, David H. Levy, and Aric B. ShoreyConference: 2020 IEEE 69th Electronic Components and Technology Conference (ECTC)Year: 2020 Keywords No Via Contamination High-Temperature Compatibility Easy Debonding...
A Handling Solution for Easy Processing of Thin...
Citation Authors: Shelby F. Nelson, David H. Levy, and Aric B. ShoreyConference: 2020 IEEE 69th Electronic Components and Technology Conference (ECTC)Year: 2020 Keywords No Via Contamination High-Temperature Compatibility Easy Debonding...
Development of Substrates Featuring Through Gla...
Citation Authors: Aric Shorey, Scott Pollard, Alex Streltsov, Garret Piech, Robert WagnerPartial Title: Development of Substrates Featuring Through Glass Vias (TGV) for 3D-IC Integration Keywords Through Glass Vias (TGV) 3D-IC...
Development of Substrates Featuring Through Gla...
Citation Authors: Aric Shorey, Scott Pollard, Alex Streltsov, Garret Piech, Robert WagnerPartial Title: Development of Substrates Featuring Through Glass Vias (TGV) for 3D-IC Integration Keywords Through Glass Vias (TGV) 3D-IC...
Through the Looking Glass: Insights into Visual...
Citation Beasley, Z., Friedman, A., Piegl, L., & Rosen, P. (2020). Leveraging peer feedback to improve visualization education. In 2020 IEEE Pacific Visualization Symposium (PacificVis) (pp. 146–155). IEEE. doi: 10.1109/PacificVis48177.2020.1261 ...
Through the Looking Glass: Insights into Visual...
Citation Beasley, Z., Friedman, A., Piegl, L., & Rosen, P. (2020). Leveraging peer feedback to improve visualization education. In 2020 IEEE Pacific Visualization Symposium (PacificVis) (pp. 146–155). IEEE. doi: 10.1109/PacificVis48177.2020.1261 ...
A High-Q Resonant Pressure Microsensor with Thr...
Citation Luo, Z.; Chen, D.; Wang, J.; Li, Y.; Chen, J. A High-Q Resonant Pressure Microsensor with Through-Glass Electrical Interconnections Based on Wafer-Level MEMS Vacuum Packaging. Sensors 2014, 14, 24244–24257. ...
A High-Q Resonant Pressure Microsensor with Thr...
Citation Luo, Z.; Chen, D.; Wang, J.; Li, Y.; Chen, J. A High-Q Resonant Pressure Microsensor with Through-Glass Electrical Interconnections Based on Wafer-Level MEMS Vacuum Packaging. Sensors 2014, 14, 24244–24257. ...